ASME International
26th Computers and Information in Engineering (CIE) Conference
September 10-13, 2006
Philadelphia, PA

Conference Call for Papers & Submissions

The Computers and Information in Engineering (CIE) Conference provides a forum for enhancing the practice of engineering by understanding the application of emerging technologies that impact critical engineering issues of representation, product design and product development, exchange, management and integration of information throughout the entire engineering product and process life-cycle.

Electronic submissions of technical papers and panel presentations are solicited by the technical committees of the Computers and Information in Engineering Division. The conference organizers encourage the submission of special technical sessions and cross conference symposia proposals.

 

Conference Chair:
Imre Horváth
Delft University of Technology
Phone: +31 15 2783520
E-mail: I.Horvath@IO.TUDelft.nl

 

Technical Program Chair:
Chris Paredis
Georgia Institute of Technology
Phone: (404) 894-5613
E-mail: chris.paredis@me.gatech.edu

 

 

The 26th CIE Conference
Electronic Paper Submission Web Site:

http://www.asmeconferences.org/IDETC06

Deadline for submissions of full draft papers is:

February 6, 2006
NOTE: this is a hard deadline.  There will be no extensions

Return to/Go to the Overall IDETC/CIE 2006 Conferences Web Pages

 

Call for Papers:
Technical Committees

Papers are solicited for presentation and discussion on:

 

 

Symposia

Symposium on Integrated Systems Engineering

Special Symposia & Sessions

Submit proposals for special symposia & sessions to the CIE Conference Technical Program Chair:
chris.paredis@me.gatech.edu

Note: This CIE Call for Papers is also available as a PDF file
(cie2006cfp.pdf)

 

Paper Submissions to the ASME Journal of Computing and Information Science in Engineering (JCISE)

The Computers and Information in Engineering Division encourages authors to submit journal quality papers to the ASME Journal of Computing and Information Science in Engineering (JCISE). Information about JCISE, which is sponsored by the CIE Division, is available through its ASME web site.

Paper submissions to the Journal are only accepted electronically and via the eLANE web site.

Engineering Information Management (EIM)

Theme: Exploiting the investment in information and knowledge

To leverage the use of information and knowledge so that more could be achieved with less is an inherent part of industrial productivity. Product Lifecycle Management (PLM) has been reported as an area of continued industrial investment.

The committee invites high quality papers covering industrial application cases as well as research topics in the general area of engineering information management, with specific emphasis on:

  • EIM/PLM implementation examples and lessons
  • Standards and interoperability
  • Information and knowledge management for products with embedded systems
  • Supply chain engineering management
  • Product information for after sales service, support and maintenance
  • Complex systems product acquisition and requirements management
  • Distributed engineering and teams collaboration - the organisation management and people dimension
  • Configuration management
  • Process, cultural and change management considerations in moving from traditional paper/document management processes to computer-intelligent product structure management issues
  • Management of virtual and real models
  • Design education in a collaborative and distributed environment

The Committee focuses on the ‘management’ of engineering information and the representation of related knowledge. Industrial implementation case studies and lessons learnt are particularly welcome. The papers are judged based on the scientific quality of innovation and rigor, as well as their value for application. An award for “Best Paper in EIM Track” is to be presented at the conference. Quality papers will be referred to the ASME Journal of Computing and Information Science In Engineering .

 

Committee Co-Chair:
Laurent Balmelli
IBM Research Division
E-mail: balmelli@us.ibm.com

 

Committee Co-Chair:
Ricardo Goncalves
Universidade do Minho
E-mail: rg@uninova.pt

 

Committee Co-Chair:
João Silva
Universidade do Minho
E-mail: jpmas@dem.uminho.pt

 

 

Computer-Aided Product Development (CAPD - CAD/CAE/CAM/CAx)

The Computer Aided Product Development (CAPD) Technical Committee is focused on fundamental research and computational tools development related to product realization. It includes research activities on all aspects of product development, from design, analysis, inspection to manufacturing, with special emphasis on the computational aspect of these research activities.

The CIE Technical Committee on Computer Aided Product Development is soliciting high quality research paper related to product development. They include but are not limited to the following topics:

  • feature-based design and manufacturing
  • CAD/CAM/CAE/CIM techniques
  • concurrent engineering techniques
  • geometric modeling
  • heterogeneous object modeling
  • sensor applications in product development
  • artificial intelligence in product development

 

Committee Chair:
Ashok V. Kumar
University of Florida
Phone: (352) 392-0816
E-Mail: akumar@ufl.edu 

 

Internet-Aided Design, Manufacturing and Commerce (IADMC)

The IADMC committee enables the exchange of knowledge to enable rapid product development. Our focus is to leverage the use of the network in product realization strategies, bridge the gaps between design-manufacturing and supply chain, and customization of products. Inherent to the committee focus is to foster the interaction of multi-disciplinary academicians, industry and government. It will also provide a platform to link theory and applications.

Submissions are welcomed in the following areas:

  • Mass Customization and Configuration (Agents, Networks, Consumer Tracking, etc.)
  • Knowledge “reuse”, representation, ontology modeling across the supply chain
  • Reconfigurable supply chain strategies and flexible manufacturing networks
  • Design to order and Configuration Management
  • Supplier networks and design integration
  • Internet-Based CAD/CAM/CAE (Including the use of Java, Agents, etc.)
  • Representation Schemes and Data Models (Including use of VRML, XML, etc.)
  • Knowledge Management and Corporate Learning
  • Rapid Modeling, Analysis and Decision-Making Methodologies
  • System Integration Issues for Collaborative Design, Manufacturing and New Product Development (Including Intranet, and Extranet Applications)
  • New Paradigms for Customer-Vendor Interaction, Supply Chain Operations and Electronic Commerce (Including Auctioning, Information Brokers, E-Malls, etc.)

 

Committee Chair:
Karthik Ramani
School of Mechanical Engineering
Purdue University
Phone: 765-494-5725
E-mail: ramani@purdue.edu

Committee Co-Chair:
Greg Roach
Honeywell International
Phone: 602-231-2473
E-mail: gregory.roach@honeywell.com

 

Virtual Environmnents and Systems (VES)

Electronic submissions of papers are sought in the following areas:

 
  • Virtual prototyping
  • Virtual reality applications in design and manufacturing
  • Virtual manufacturing process models
  • Virtual environments for life-cycle design
  • Virtual enterprises for product development
  • VR in education

 
  • CAD and Computer Graphics Issues in VR
  • Augmented reality models and applications
  • Real time simulation using virtual reality
  • Production line implementations of VR
  • Product/process data interchange models for virtual systems
  • Virtual environments for engineering applications

 

 

 

Committee Chair:
Peter Ebbesmeyer
UNITY AG, Germany
Phone: +49 2955 743 260
E-Mail: peter.ebbesmeyer@unity.de

 

Computers in Electromechanical Systems (CINEMAS)

The ASME Computers in Electromechanical Systems (CINEMAS) Technical Conference brings together academic researchers and students, industry experts and government professionals with interests in the use of computers as part of electromechanical systems. In CINEMAS the focus is on the deployed computer: whether used for data acquisition, plant control, human interface or similar purposes, the computer is sharing the work. CINEMAS is a multidisciplinary group, including not only mechanical engineers but electrical engineers, computer scientists and related professionals who design, program and integrate computers with the physical world. CINEMAS’ purpose is to provide a forum for discussing research advances, practical implementations, system architectures and engineering tools that reduce the cost, shorten the development time and improve the performance of computers in electromechanical systems.

The CINEMAS Technical Committee encourages authors to submit relevant papers. Topics of interest include but are not limited to:

 
  • hardware and software codesign
  • real-time operating systems
  • embedded computing
  • hardware-in-the-loop simulation
  • system design
  • mechatronics
  • distributed control
  • device interfaces, buses and protocols
  • performance metrics
  • commercial off-the-shelf integration
  • hardware and software architectures
  • programming environments
  • software optimization and partitioning
  • synchronization
  • executable designs
  • robotics
  • mobile systems
  • machine control
  • data acquisition
  • human-machine interfaces

Poster submissions are encouraged for those participants who wish to present their work in a less formal and more interactive manner. Poster submitters should be prepared to staff their presentations for a two-hour period during the conference.

Exhibit space is available for companies who wish to demonstrate products of relevance to the CINEMAS audience. Please contact the CINEMAS Program Chair directly.

 

Committee & Program Chair:
Frederick Proctor
National Institute of Standards and Technology
Phone: 301-975-3425
Email: frederick.proctor@nist.gov

Program Co-Chair:
Harry H. Cheng
University of California, Davis
E-Mail: hhcheng@ucdavis.edu

Program Committee:

Harry Cheng, University of California Davis; Chetan Jadhav, Chin-Pei Tang, Seung Kook Jun & Rajan Bhatt, SUNY Buffalo; Peng Song, University of Pennsylvania; Anupam Saxena, India Institute of Technology Kanpur; Andy Suri and Viswanath Ananth, Pathway Technologies

 

Non-Traditional Computing (NTC)

Papers are sought in the areas of applications of non-traditional computing methods such as fuzzy logic, genetic algorithms, neural nets on intelligent manufacturing, intelligent design and database management.

 

Committee Chair:
Anthony de Sam Lazaro
St. Martin’s College
Phone: (360) 438-4320
E-Mail: lazaro@stmartin.edu

 

Energy Systems (ES)

Papers in the following areas are encouraged for submission:

 
  • computers in combustion
  • fires
  • energy systems
  • computational fluid mechanics
  • computational heat transfer
  • energy
  • thermofluids and environment
  • modeling of waste thermal destruction systems
  • pollution

 

Committee Co-Chair:
Ryo S Amano
University of Wisconsin-Milwaukee
Phone: (414) 229-2345
E-mail: amano@uwm.edu

Committee Co-Chair:
Ashwani K. Gupta
University of Maryland
Phone: (301) 405-5276
E-mail: akgupta@eng.umd.edu

 

Computational Technologies for Engineering Sciences Applications (CTESA)

Papers in the following areas are invited:

  • Modeling and Simulation driven Problem Solving Environments.
  • Algorithmic development of modeling of continua including analog (computationally produced closed-form approaches), as well as discrete methods fin space and time for ODE and PDE models including Finite Element/Volume, Boundary Element, Finite Differences etc. modeling and analysis techniques,
  • Qualification, Validation and Verification of Computational Technologies associated with the behavior of continua modeling and simulation areas.
  • Automated Code/Application/Environment/Framework Generation Technologies.
  • Symbolic Algebra-based model and software generation.
  • Intra- and inter-application data exchange technologies for behavioral modeling and simulation
  • Technologies supporting synthetic and compositional behavior simulation of systems
  • Heterogeneous and Distributed Application Integration methods and IT systems and resources for M&S of behavior of continua.

 

Committee Co-Chair:
John Michopoulos
U.S. Naval Research Laboratory
E-Mail: john.michopoulos@nrl.navy.mil

 

 

 

 

 

 

 

 

 

 

Computers in Education (CIE)

Papers are solicited in the following areas:

 
  • multimedia for engineering education
  • the role of internet in higher education
  • CAD and robotics in higher education
  • mechatronics and data acquisition
  • software tools in the classroom

 

 

Committee Chair:
Mohammad Khosrowjerdi
Western New England College
Phone: (413) 782-3111, (413) 596-4405
E-mail: mkhosrow@charter.net

 

 

 

 

 

 

Last Revised: 1/13/06