The
Electronic and Photonic
Packaging Division (EPPD) of ASME has as its objectives
international cooperation, understanding, and promotion of
efforts and disciplines in Microelectronics, Photonics, Microwave
and Microelectromechanical Systems Packaging Engineering.
The Division is concerned with all design and engineering
aspects related to theoretical (analytical and computer-aided)
and experimental problems and results associated with the
application of methods and approaches of engineering and applied
mechanics to the analysis, design, manufacturing, testing
and operation of microelectronics, optoelectronics and photonics
components, devices, equipment and systems.
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